Dental adhesive system designed for enamel etching technique, which is considered the ideal approach to obtain a good seal of margins and apprpriate resin tag infiltration into the dentin. These features help to ensure the aesthetics of the margins in the long term and minimize post-operative sensitivity, associating force of adhesion to tooth structure, providing greater integrity to dentin and protecting it from the trauma caused by the etching gel.
Bonding of light or dual-cured composite to:
After preparing the cavity, apply the etching gel (Tokuyama Etching Gel HV) on the enamel parts of the cavity and wait 5 or more seconds. Rinse thoroughly for at least 10 seconds with a water jet under suction. Dry the surfaces with a mild air jet (indirectly). Apply the appropriate amount of Tokuyama EE-Bond on the surfaces with a brushing motion, wait 10 seconds, dry for 10 seconds, of which the first 5 indirectly, light-cure for 10 or more seconds.
– art. 14111 | Tokuyama EE-Bond Intro Kit:
art. 14103 | Tokuyama Etching Gel HV Syringe: 2 syringes Tokuyama Etching Gel HV 2.5ml each, 20 tips
art. 14104 | Tokuyama Etching Gel HV Tip: 50 tips
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