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Tokuyama EE-Bond

Dental adhesive system designed for enamel etching technique, which is considered the ideal approach to obtain a good seal of margins and apprpriate resin tag infiltration into the dentin. These features help to ensure the aesthetics of the margins in the long term and minimize post-operative sensitivity, associating force of adhesion to tooth structure, providing greater integrity to dentin and protecting it from the trauma caused by the etching gel.

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Bonding of light or dual-cured composite to:

  • cut/uncut enamel
  • cut/uncut dentin
  • fractured porcelain/composite repair
  • Outstanding adhesion performance
  • Dependable marginal integrity (minimized micro-leakage)
  • Less post-operative sensitivity
  • Perfectly sealed cavities
  • Lower technique-sensitivity
  • Fluoride-releasing
  • Extra fine dispensing tip
  • Thixotropic gel with ideal viscosity: it remains where placed without running off and contaminating the underlying dentin
  • Easy to visualize and rinse

After preparing the cavity, apply the etching gel (Tokuyama Etching Gel HV) on the enamel parts of the cavity and wait 5 or more seconds. Rinse thoroughly  for at least 10 seconds with a water jet under suction. Dry the surfaces with a mild air jet (indirectly). Apply the appropriate amount of Tokuyama EE-Bond on the surfaces with a brushing motion, wait 10 seconds, dry for 10 seconds, of which the first 5 indirectly, light-cure for 10 or more seconds.

art. 14111 | Tokuyama EE-Bond Intro Kit:

  • 1 bottle, 5.0ml
  • 25 applicators
  • 1 dish
  • 1 syringe Tokuyama Etching Gel HV, 2.5ml
  • 10 tips

 

 

Spare Parts:

art. 14103 | Tokuyama Etching Gel HV Syringe: 2 syringes Tokuyama Etching Gel HV 2.5ml each, 20 tips
art. 14104 |
Tokuyama Etching Gel HV Tip: 50 tips

To view or download the MSDS/Material Safety Data Sheet of all our products, please follow the link below:

www.tokuyama-dental.com/tdc/msds.html

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