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Tokuyama EE-Bond and Tokuyama Bond Force – ASSESSMENT OF ADHESION TO DENTIN AND QUALITY OF INTERFACES OBTAINED

Responsibility for the study: Prof. Jean-Pierre ATTAL
Tests: Dr. Stéphane LE GOFF
Statistical analysis: Dr. Elisabeth DURSUN

Unité de recherches biomatériaux interfaces et innovations
URB2I EA 4462 (Paris Descartes)

” Based on the results of our study, both tested bonding agents display excellent microtensile bond values, on dentin and on enamel as well. This mechanical quality of adhesion is associated with the seal of the two interfaces that is observed under the scanning electron microscope. In this stage the two products can be hardly distinguished.
But, if etching with orthophosphoric acid for 15 seconds is considered, we can state that Tokuyama EE-Bond displays the best adhesion values and excellent seal. In this configuration, Tokuyama EE-Bond is probably slightly superior to Tokuyama Bond Force. On enamel, the difference seems not to be significant.
Therefore, to answer the question that was raised at the beginning of this study, we can state that it seems that the performance of Tokuyama EE-Bond in terms of adhesion and seal is either identical or slightly superior to that of Bond Force, especially on etched dentin.
Dentists who perform the enamel selective etch technique might be interested to know that if a bit of acid trickles down on dentin, the quality of the bond will not be affected at all by it. ”

 

Look at the attachments to view and / or download the complete research.

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